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Description
:Delivering advanced packaging and 3DIC design planning flows for foundry and customer solutions primarily using Cadence Integrity, but knowledge of Virtuoso and APD as well is desired.
Work in a team environment creating and implementing 3DIC reference flows and designs.
The candidate is expected to be an advanced level user of 3DIC design planning tools, preferably Integrity.
Floorplanning knowledge in Innovus to deliver best solutions to costumers.
Requirements:
Complete Bachelor’s degree in Electrical or Electronics Engineering
Experience with package design with Intergrity is desired
Strong knowledge of advanced packaging concepts
Must be familiar with 3Dblox design methodology. Experience in YAML language is a plus.
Strong knowledge of 2.5D, 3DIC and stacked die technologies
Good programming kn...