SearchLondonJobs.co.uk

🏛️ London's Premier Job Portal

← Back to London Jobs

Photonic Process Engineer: Wire Bonding & Die Attach

Company: Ciena Corporation

Location: ottawa, London

Posted: June 04, 2026

Apply for This Position

Submit Application

Position Details

A leading technology firm in Ottawa is seeking a motivated Process Engineer to optimize assembly processes for Photonic Integrated Circuit products. The ideal candidate has a Bachelor’s degree in mechanical engineering and 2–3 years of relevant experience. Responsibilities include designing wire bonding recipes and conducting reliability testing. Competitive salary range of $71,600 to $114,400 and comprehensive benefits offered.
#J-18808-Ljbffr