Our international client is currently searching for an IC Packaging Technical Lead to drive all package related activities including materials development with subcon partners.

The role will involve participating in design reviews to design BGA packages and perform feasibility studies for substrate technology and electrical performance.Cooperating with assembly centre R&D teams for continuous design performance will be an important part of the role.

Required skills for the IC Packaging Technical Lead will include:

Strong IC package assembly development experience

BGA and flip chip knowledge

Semiconductor packaging qualification experience

Excellent communication skills, French language preferred

Degree qualified in Electrical Engineering, Physics or similar

Please contact Rachel Anderson for further details.